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FEATURES Low On Resistance 2.5 Max <0.6 On Resistance Flatness Dual 2.7 V to 5.5 V or Single 2.7 V to 5.5 V Supplies Rail-to-Rail Input Signal Range Tiny 6-Lead SOT-23 and 8-Lead Micro-SOIC Packages Low Power Consumption TTL/CMOS-Compatible Inputs APPLICATIONS Automatic Test Equipment Power Routing Communication Systems Data Acquisition Systems Sample and Hold Systems Avionics Relay Replacement Battery-Powered Systems GENERAL DESCRIPTION
S
2 CMOS 5 V/5 V, SPST Switches ADG601/ADG602
FUNCTIONAL BLOCK DIAGRAMS
D S D
IN
IN
ADG601
ADG602
SWITCHES SHOWN FOR A LOGIC "1" INPUT
Table I. Truth Table
The ADG601/ADG602 are monolithic CMOS SPST (Single Pole, Single Throw) switches with On Resistance typically less than 2.5 . The Low On Resistance flatness makes the ADG601/ ADG602 ideally suited to many applications, particularly those requiring low distortion. These switches are ideal for replacements for mechanical relays because they are more reliable, have lower power requirements, and package size is much smaller. The ADG601 is a normally open (NO) switch, while the ADG602 is normally closed (NC). Each switch conducts equally well in both directions when ON, with the input signal range extending to the supply rails. They are available in tiny 6-lead SOT-23 and 8-lead MicroSOIC packages.
ADG601 In 0 1
ADG602 In 1 0
Switch Condition OFF ON
PRODUCT HIGHLIGHTS
1. 2. 3. 4.
Low On Resistance (2 typical) Dual 2.7 V to 5.5 V or Single 2.7 V to 5.5 V Supplies Tiny 6-lead SOT-23 and 8-lead Micro-SOIC Packages Rail-to-Rail Input Signal Range
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2001
ADG601/ADG602 -SPECIFICATIONS
DUAL SUPPLY (V
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tON tOFF Charge Injection Off Isolation Bandwidth -3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD ISS 0.001 1.0 0.001 1.0
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
2
DD
=5V
10%, VSS = -5 V
10%, GND = 0 V, unless otherwise noted.)
B Version -40oC to +85oC VSS to VDD
25oC
Unit V typ max typ max
Test Conditions/Comments
2 2.5 0.35 0.4
5.5 0.6
VDD = +4.5 V, VSS = -4.5 V VS = 4.5 V, IS = -10 mA; Test Circuit 1 VS = 3.3 V, IS = -10 mA
0.01 0.25 0.01 0.25 0.01 0.25
1 1 1 2.4 0.8
nA typ nA max nA typ nA max nA typ nA max
VDD = +5.5 V, VSS = -5.5 V VS = +4.5 V/-4.5 V, VD = -4.5 V/+4.5 V; Test Circuit 2 VS = +4.5 V/-4.5 V, VD = -4.5 V/+4.5 V; Test Circuit 2 VS = VD = +4.5 V, or -4.5 V; Test Circuit 3 V min V max
0.005 0.1 2 80 120 45 75 250 -60 180 50 50 145
A typ A max pF typ ns typ ns max ns typ ns max pC typ dB typ MHz typ pF typ pF typ pF typ
VIN = VINL or VINH
155 90
RL = 300 , CL = 35 pF VS = 3.3 V; Test Circuit 4 RL = 300 , CL = 35 pF VS = 3.3 V; Test Circuit 4 VS = 0 V, RS = 0 , CL = 1 nF; Test Circuit 5 RL = 50 , CL = 5 pF, f = 1 MHz; Test Circuit 6 RL = 50 , CL = 5 pF; Test Circuit 7 f = 1 MHz f = 1 MHz f = 1 MHz VDD = +5.5 V, VSS = -5.5 V Digital Inputs = 0 V or 5.5 V Digital Inputs = 0 V or 5.5 V
A typ A max A typ A max
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REV. 0
ADG601/ADG602 SINGLE SUPPLY1 (V
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tON tOFF Charge Injection Off Isolation Bandwidth -3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD 0.001 1.0
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
2
DD
=5V
10%, VSS = 0 V, GND = 0 V, unless otherwise noted.)
B Version -40 C 25 C to +85 C 0 V to VDD 3.5 5 0.2 8 0.2 0.35
Unit V typ max typ max
Test Conditions/Comments
VDD = 4.5 V VS = 0 V to 4.5 V, IS = -10 mA; Test Circuit 1 VS = 1.5 V to 3.3 V, IS = -10 mA
0.01 0.25 0.01 0.25 0.01 0.25
1 1 1 2.4 0.8
nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ ns typ ns max ns typ ns max pC typ dB typ MHz typ pF typ pF typ pF typ
VDD = 5.5 V VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = VD = 4.5 V, or 1 V; Test Circuit 3
0.005 0.1 2 110 220 50 80 20 -60 180 50 50 145
VIN = VINL or VINH
280 110
RL = 300 , CL = 35 pF VS = 3.3 V; Test Circuit 4 RL = 300 , CL = 35 pF VS = 3.3 V; Test Circuit 4 VS = 0 V, RS = 0 , CL = 1 nF, Test Circuit 5 RL = 50 , CL = 5 pF, f = 1 MHz, Test Circuit 6 RL = 50 , CL = 5 pF, Test Circuit 7 f = 1 MHz f = 1 MHz f = 1 MHz VDD = 5.5 V Digital Inputs = 0 V or 5.5 V
A typ A max
REV. 0
-3-
ADG601/ADG602
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C unless otherwise noted)
PIN CONFIGURATIONS 6-Lead Plastic Surface Mount (SOT_23) (RT-6)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +6.5 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -6.5 V Analog Inputs2 . . . . . . . . . . . . . . . . . VSS -0.3 V to VDD +0.3 V Digital Inputs2 . . . . . . . . . . . . . . . . . . . . -0.3 V to VDD +0.3 V or 30 mA, whichever occurs first Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150C Micro-SOIC Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206C/W JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44C/W SOT_23 Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6C/W JC Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99C/W Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300C IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220C
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
VDD 1 S2 VSS 3
8
IN D
ADG601/ ADG602
7
TOP VIEW 6 GND (Not to Scale)
8-Lead Small Outline Micro-SOIC (RM-8)
D1 NC 2 NC 3
8
S GND
ADG601/ ADG602
7
6 IN TOP VIEW VDD 4 (Not to Scale) 5 VSS
NC = NO CONNECT
ORDERING GUIDE
Model ADG601BRT ADG601BRM ADG602BRT ADG602BRM
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description Plastic Surface-Mount (SOT_23) Micro Small Outline (Micro-SOIC) Plastic Surface-Mount (SOT_23) Micro Small Outline (Micro-SOIC)
Package Option RT-6 RM-8 RT-6 RM-8
Branding Information* STB STB SUB SUB
*Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints.
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
-4-
REV. 0
ADG601/ADG602
TERMINOLOGY
VDD VSS IDD ISS GND S D IN VD (VS) RON RFLAT(ON) IS (OFF) ID (OFF) ID, IS (ON) VINL VINH IINL(IINH) CS (OFF) CD (OFF) CD,CS(ON) CIN tON tOFF Charge Injection Off Isolation On Response Insertion Loss
Most Positive Power Supply Potential Most Negative Power Supply Potential Positive Supply Current Negative Supply Current Ground (0 V) Reference Source Terminal. May be an input or output. Drain Terminal. May be an input or output. Logic Control Input Analog Voltage on Terminals D, S Ohmic Resistance Between D and S Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal range. Source Leakage Current with the Switch "OFF" Drain Leakage Current with the Switch "OFF" Channel Leakage Current with the Switch "ON" Maximum Input Voltage for Logic "0" Minimum Input Voltage for Logic "1" Input Current of the Digital Input "OFF" Switch Source Capacitance. Measured with reference to ground. "OFF" Switch Drain Capacitance. Measured with reference to ground. "ON" Switch Capacitance. Measured with reference to ground. Digital Input Capacitance Delay Between Applying the Digital Control Input and the Output Switching On. Delay Between Applying the Digital Control Input and the Output Switching Off. A measure of the glitch impulse transferred from the digital input to the analog output during switching. A measure of unwanted signal coupling through an "OFF" Switch. Frequency Response of the "ON" Switch Loss Due to the ON Resistance of the Switch
Typical Performance Characteristics
5 TA 4
ON RESISTANCE -
10 25 C 9 8
ON RESISTANCE -
5 VDD VDD 2.7V 3.0V
ON RESISTANCE -
VDD VSS 4
+5V -5V
2.5V 3V
7 6 5 4 3 2 1 TA 25 C VSS 0V 0 VDD 5.0V VDD 3.3V VDD 4.5V
3 4.5V 2
3.3V
3 +85 C +25 C 2
1
5V
1 -40 C 0
0 -5 -4 -3 -2 -1 0 1 VD, VS - V 2 3 4 5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VD, VS - V
-5 -4
-3 -2
-1 0 1 VD, VS - V
2
3
4
5
TPC 1. On Resistance vs. VD(VS) (Dual Supply)
TPC 2. On Resistance vs. VD(VS) (Single Supply)
TPC 3. On Resistance vs. VD(VS) for Different Temperatures (Dual Supply)
REV. 0
-5-
ADG601/ADG602 -Typical Performance Characteristics (continued)
5 +85 C
0.5 0.4 VDD 5V VSS 0V VD 4.5V 1V VS 1V 4.5V
CURRENT - nA
0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 10 20 30 40 50 60 TEMPERATURE - C 70 80 85 0 10 20 30 40 50 60 TEMPERATURE - C 70 80 85 ID (OFF) IS (OFF) ID, IS (ON) VDD VSS VD VS +5V -5V 4.5V 4.5V
4
ON RESISTANCE -
0.3
3
CURRENT - nA
0.2 0.1 0 -0.1 -0.2
ID, IS (ON)
2 -40 C 1 VDD VSS 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VD, VS - V 5V 0V +25 C
ID (OFF) IS (OFF)
-0.3 -0.4 -0.5
TPC 4. On Resistance vs. VD(VS) for Different Temperatures (Single Supply)
TPC 5. Leakage Currents vs. Temperature (Single Supply)
TPC 6. Leakage Currents vs. Temperature (Dual Supply)
500 450 CHARGE INJECTION - pC 400 350 TA 25 C
180 160 140
VDD VSS +5V -5V VDD VSS 5V 0V
0 -10
ATTENUATION - dB
VDD VSS tON
5V 0V VDD VSS +5V -5V
-20 -30 -40 -50 -60
120 TIME - ns 100 80 60 40 20 VDD VSS -20 5V 0V tOFF
300 250 200 150 100 50 0 -5 -4
VDD VSS
+5V -5V 80
-70 -80 0.2
VDD +5V VSS -5V TA 25 C 10 1 FREQUENCY - MHz 100
-3 -2
-1
0 1 VS - V
2
3
4
5
0 -40
0 20 40 60 TEMPERATURE - C
TPC 7. Charge Injection vs. Source Voltage
TPC 8. tON/tOFF Times vs. Temperature
TPC 9. Off Isolation vs. Frequency
0
-2 ATTENUATION - dB
-4
-6
-8 VDD +5V VSS -5V TA 25 C 1 10 100 FREQUENCY - MHz 400
-10
-12 0.2
TPC 10. On Response vs. Frequency
-6-
REV. 0
ADG601/ADG602
TEST CIRCUITS
IDS
IS (OFF)
V1 S D
A VS
S
D
ID (OFF) A VD NC = NO CONNECT NC S D
ID (ON) A VD
VS
RON = V1/IDS
Test Circuit 1. On Resistance
VDD 0.1 F
Test Circuit 2. Off Leakage
Test Circuit 3. On Leakage
VSS 0.1 F VIN
ADG601
50%
50%
VDD S VS
VSS D RL 300 GND CL 35pF VOUT VOUT
VIN
ADG602
50% 90%
50% 90%
IN
t ON
t OFF
Test Circuit 4. Switching Times
VDD
VSS
VDD RS VS IN S
VSS D CL 1nF GND VOUT
VIN
ADG601
ON OFF
VIN VOUT
ADG602
QINJ = CL VOUT VOUT
Test Circuit 5. Charge Injection
VDD 0.1 F 0.1 F NETWORK ANALYZER
0.1 F
VDD
VSS 0.1 F NETWORK ANALYZER
VDD S IN D VIN GND
VSS
VDD S
VSS
50 50 VS VOUT RL 50
IN
50 VS D VOUT
VIN GND
RL 50
OFF ISOLATION = 20 LOG
VOUT VS
INSERTION LOSS = 20 LOG
VOUT WITH SWITCH VS WITHOUT SWITCH
Test Circuit 6. Off Isolation
Test Circuit 7. Bandwidth
REV. 0
-7-
ADG601/ADG602
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
8-Lead Micro-SOIC (RM-8)
0.122 (3.10) 0.114 (2.90)
8
5
0.122 (3.10) 0.114 (2.90)
1 4
0.199 (5.05) 0.187 (4.75)
PIN 1 0.0256 (0.65) BSC 0.120 (3.05) 0.112 (2.84) 0.006 (0.15) 0.002 (0.05) 0.018 (0.46) SEATING 0.008 (0.20) PLANE 0.043 (1.09) 0.037 (0.94) 0.011 (0.28) 0.003 (0.08) 0.120 (3.05) 0.112 (2.84) 33 27
0.028 (0.71) 0.016 (0.41)
6-Lead Plastic Mount SOT-23 (RT-6)
0.122 (3.10) 0.106 (2.70)
6
5
4
0.071 (1.80) 0.059 (1.50)
1 2 3
0.118 (3.00) 0.098 (2.50)
PIN 1 0.075 (1.90) BSC 0.051 (1.30) 0.035 (0.90) 0.037 (0.95) BSC
0.057 (1.45) 0.035 (0.90) 10 0
0.006 (0.15) 0.000 (0.00)
0.020 (0.50) 0.010 (0.25)
SEATING PLANE
0.009 (0.23) 0.003 (0.08)
0.022 (0.55) 0.014 (0.35)
-8-
REV. 0
PRINTED IN U.S.A.
C02619-.8-10/01(0)

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